? semiconductor components industries, llc, 2005 october, 2005 ? rev. 3 1 publication order number: BAS21HT1/d BAS21HT1 preferred device high voltage switching diode features ? pb?free packages are available maximum ratings symbol rating value unit v r continuous reverse voltage 250 vdc v rrm repetitive peak reverse voltage 250 vdc i f peak forward current 200 madc i fm(surge) peak forward surge current 625 madc thermal characteristics symbol characteristic max unit p d total device dissipation fr?5 board, (note 1) t a = 25 c derate above 25 c 200 1.57 mw mw/ c r ja thermal resistance, junction?to?ambient 635 c/w t j , t stg junction and storage temperature range ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. fr?5 minimum pad high voltage switching diode device package shipping ? ordering information BAS21HT1 sod?323 3000/tape & reel sod?323 case 477 style 1 preferred devices are recommended choices for future use and best overall value. 1 cathode 2 anode http://onsemi.com marking diagram ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. BAS21HT1g sod?323 (pb?free) 3000/tape & reel bas21ht3 sod?323 10,000/tape & ree l bas21ht3g sod?323 (pb?free) 10,000/tape & ree l js m 1 2 js = device code m = date code* = pb?free package (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location.
BAS21HT1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics reverse voltage leakage current (v r = 200 vdc) (v r = 200 vdc, t j = 150 c) i r ? ? 0.1 100 adc reverse breakdown voltage (i br = 100 adc) v (br) 250 ? vdc forward voltage (i f = 100 madc) (i f = 200 madc) v f ? ? 1000 1250 mv diode capacitance (v r = 0, f = 1.0 mhz) c d ? 5.0 pf reverse recovery time (i f = i r = 30 madc, r l = 100 ) t rr ? 50 ns notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 30 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 30 ma. notes: 3. t p ? t rr +10 v 2.0 k 820 0.1 f d.u.t. v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 3.0 ma output pulse (i f = i r = 30 ma; measured at i r(rec) = 3.0 ma) i f input signal figure 1. recovery time equivalent test circuit figure 2. forward voltage figure 3. reverse leakage forward current (ma) 7000 reverse current (na) reverse voltage (v) 5000 3000 5 0 2 1 6000 4000 6 5 10 20 50 100 200 1 2 3 4 t a = ?55 c 300 t a = 155 c t a = 25 c t a = ?55 c 1 10 100 1000 1 200 400 600 800 1000 1200 forward voltage (mv) 155 c 25 c
BAS21HT1 http://onsemi.com 3 package dimensions sod?323 plastic package case 477?02 issue g h e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c style 1: pin 1. cathode 2. anode note 5 l 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 BAS21HT1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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